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Solvay Specialty Polymers' KetaSpire PEEK Products are Qualified at COMAC

  • Tuesday, 21st October 2014
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Five of Solvay Specialty Polymers’ KetaSpirepolyetheretherketone (PEEK) grades have earned qualification at the Commercial Aircraft Corporation of China (COMAC), a leading Chinese aircraft manufacturer, for use on its next-generation aircraft.

According to Solvay, these five materials are the first KetaSpire PEEK grades to be qualified at Shanghai-based COMAC, opening up a broad range of new commercial opportunities for Solvay in the Chinese market.

The demand for commercial aircraft is growing at a torrid pace in China and manufacturers continue to make increasing use of high-performance thermoplastics, according to Armin Klesing, Business Development Manager, Aerospace and Composites, for Solvay Specialty Polymers. “We’re excited about earning qualification at COMAC and delivering the lightweight material options that optimise design, improve performance, and reduce cost,” said Klesing. “As an industry-leading supplier of ultra-high performance polymers, we look forward to working with COMAC and their supply chain to collaboratively develop new solutions for the most demanding of applications.”

The five materials which have been added to COMAC’s qualified product list (QPL) are KetaSpire KT-880 NT neat resin, KetaSpire KT-820 NT neat resin, KetaSpire KT-880 GF30 (30% glass fibre filled), KetaSpire KT-880 CF30 (30% carbon fibre filled), and KetaSpire KT-820 GF30 (30% glass fibre filled). KetaSpire KT-820 is a low melt flow resin while KetaSpire KT-880 is a high flow resin. The materials will be used in the new COMAC C919, a family of 158- to 174-seat narrow-body aircraft. The C919 will be the largest commercial airliner designed and built in China. The KetaSpire PEEK grades are also expected to be used in the COMAC ARJ21 Xiangfeng, a twin-engine regional aircraft.

Solvay expects its collaboration with COMAC to lead to new material qualifications in the future, according to Klesing. Solvay’s Torlon polyamide-imide (PAI) is also expected to be evaluated for use in future COMAC aircraft.


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