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Dymax has been awarded a new patent by the United States Patent and Trademark Office (USPTO).
US Patent No. 9,394,436 entitled ‘Form-In-Place Gasket With Tack Free Surface’ was received for a method for preparing a flexible, substantially tack free gasket by forming a liquid composition that would enclose displays, electronic circuits and similar components.
According to Dymax, this composition is distributed onto a substrate and then exposed to actinic radiation to cure the liquid composition into a flexible, substantially tack free gasket having a Shore A hardness range of A20 to A80. Resins formulated with this patented formula, such as GA-201, can be dispensed into intricate and complex configurations with the added benefit of curing in-line which allows for increased production speed and reduced inventories.
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