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CPS Corporation, worldwide designer and producers of metal matrix composites, offers a new AlSiC (Aluminum Silicon Carbide) metal matrix composite.
Unlike traditional packaging materials, AlSiC enables a tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies.
The isotropic CTE value of AlSiC can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. AlSiC’s CTE matching capabilities eliminate the need for thermal interface stacking, increasing reliability in the field.
AlSiC also exhibits a high thermal conductivity that results in extremely efficient thermal dissipation. Coupled with its superior CTE matching, AlSiC’s high thermal conductivity prevents the bowing and flexing of packaging and substrate material that can lead to failure. Traditional packaging materials with lower thermal dissipation can cause delamination, leading to air gaps and poor reliability.
The CPS AlSiC near and net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and allowing rapid prototyping for high volume advanced thermal management solutions. The unique casting process enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes for more advanced thermal management solutions.
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