CPS Corporation has produced AlSiC (Aluminum Silicon Carbide), a metal matrix composite that provides reliable and cost-effective solutions for various electronic devices and assemblies.
AlSiC (Aluminum Silicon Carbide) enables tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies; isotropic CTE value is adjusted by modifying Al-metal/SiC-particulate ratio. The product is suited for housing, interconnection, and thermal management of microelectronic, optoelectronic, and power electronic devices.
AlSiC is also claimed to exhibit a high thermal conductivity that results in extremely efficient thermal dissipation. Coupled with its superior CTE matching, AlSiC’s high thermal conductivity prevents the bowing and flexing of packaging and substrate material that can lead to failure. Traditional packaging materials with lower thermal dissipation can cause delamination, leading to air gaps and poor reliability.
The CPS AlSiC near and net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and allowing rapid prototyping for high volume advanced thermal management solutions. The casting process enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes for more advanced thermal management solutions.
For more information visit:
Subscribe to receive our weekly round-up of all the industry's latest news, jobs, events and more!