31 January 2019
31 January 2019
Solvay adds 10% carbon fibre filled KetaSpire polyetheretherketone (PEEK) and neat Radel polyphenylsulfone (PPSU) to e-Xstream engineering’s latest release (2019.0) of Digimat-Additive Manufacturing (AM) software.
These products complement the neat KetaSpire PEEK AM filament already available for simulation on e-Xstream engineering’s Digimat-AM platform. “Our growing range of AM filaments underscores Solvay’s determination to establish itself as an industry leader in this rapidly evolving market,” says Christophe Schramm, Additive Manufacturing Business Manager in the company’s Specialty Polymers global business unit. “Digimat-AM allows customers to simulate the printing process and successfully predict the thermomechanical behaviour of 3D-printed designs in order to ‘print right the first time’.”
These new materials will benefit from e-Xstream engineering’s Digimat-AM Advanced Solver. This software offers highly accurate, predictive modelling data for Solvay’s AM filaments over a wide range of critical characteristics, including detailed warpage and residual stress, to help designers and engineers optimise the process and minimise part deformation before printing. For highly demanding applications, Digimat further enables design validation by predicting the printed part performance (stiffness, strength, etc.) as a function of the material and the printing process parameters.
“With the addition of Solvay’s new AM grades, we now have a wider portfolio of 3D printing grades in Digimat to provide cutting-edge new materials to push the design and application boundaries in this dynamic market,” adds Roger Assaker, CEO of e-Xstream engineering and Chief Material Strategist for MSC Software. “As a result of our partnership, we bridge the gap in simulation engineering between high-performance polymers and demanding printing processes such as Fused Filament Fabrication.”
Photo provided by Solvay
Foster Corporation has seen its business flourish in the last few years. As a result of this growth, Foster has broken ground on a new state-of-the-art 55,780 ft2 (5,182 m2) manufacturing facility that is adjacent to its headquarters in Putnam, Connecticut, US.
Composite Cluster Singapore (CCS) announces that it is working with Eviation Aircraft on ‘Alice’ – a fully electric aircraft structure that is currently showcased at the 53rd International Paris Air Show in Le Bourget, France.
Stratasys announces it is deepening its partnership with Boom Supersonic – the Colorado-based company building history’s fastest supersonic airliner. In signing a seven-year agreement extension, the companies are further accelerating adoption of additive manufacturing for 3D-printed flight hardware.