20 March 2018
20 March 2018
Dow Automotive Systems is leveraging its structural adhesives portfolio and development expertise to offer BETAFORCE, BETAMATE and BETASEAL solutions that enhance lightweight module construction.
Liftgate/hatchback, decklids and front-end carrier modules are increasingly designed using a multi-material mix to decrease weight while maintaining design flexibility, styling and safety performance. Structural bonding of these lightweight modules delivers on these customer needs.
“For those Tiers and OEMs adopting mixed-material design, 3 kg to 10 kg weight savings per module have already been realised,” states Christophe Van Herreweghe, Marketing Manager – Body & Exteriors, Dow Automotive Systems. “Use of Dow structural adhesives helps enable those targets and further enhances the module through the ability to bond dissimilar substrates, reduce welding and mechanical fasteners, seal against corrosion for better durability and increase strength and stiffness for crash worthiness and enhanced customer driving experience.”
Dow adhesives are developed with rapid-cure characteristics that process well in mass production manufacturing environments. Primerless-to-plastic formulations help remove VOCs from assembly operations, and new multifunctional adhesives are in development.
Structural bonding of modular assemblies has a success record of over 20 years. Dow products are on current platforms including the Jeep Cherokee liftgate – through collaboration with Magna – and will be launched on other 2019 series later this year.
Photo provided by Dow Automotive
The environmental credentials of battery electric vehicles were questioned at the latest Future of Technology seminar organised by the Advanced Propulsion Centre (APC) and Innovate UK.
Scigrip has expanded its agreement with Biesterfeld Spezialchemie to include France and the French territories in Northern Africa, with immediate effect.
EconCore will unveil the latest developments in its thermoplastic honeycomb core production technology at NPE2018 on 7-11 May in Orlando, Florida, US.