17 January 2017
17 January 2017
Intertronics has launched its DYMAX Speedmask 9-20479-B-Rev-A UV/light cure temporary masking agent, specifically designed to meet the needs of the electronics industry, where its fast cure and simple removal will improve productivity in printed circuit board assembly.
According to Intertronics, it is formulated for the protection of PCB connectors and other components, either during the soldering process, or during conformal coating. It features a particularly tight viscosity tolerance which aids in maintaining good process control during application.
Intertronics claims that speedmask 9-20479-B-Rev-A maximises production speed as it cures in seconds under UV/visible light and is solvent and silicone free. It says it is benign to gold or copper finishes on connector pins or other components. It is extremely thixotropic – flowing easily and consistently with all forms of manual, semi-automatic or fully automated dispensing and then forming a stable coating prior to a fast light cure. It is easily and quickly removed by peeling, leaving behind no ionic or silicone contamination.
Photo provided by Intertronics
The Metyx Hungary factory, located in Kaposvár, has recently expanded its warehousing facilities, adding an additional 3,024 m2 of enclosed storage space for composite technical fabrics, packaging and FRP tooling.
The American Composites Manufacturers Association participated in a roundtable discussion about the IMAGINE Act. Known as the Innovative Materials in American Growth and Infrastructure, Newly Expanded (IMAGINE) Act, the new bill is designed to promote the increased use of innovative materials like fibre reinforced polymer (FRP) composites, as well as new manufacturing methods to accelerate the deployment and extend the life of infrastructure projects.
3A Composites Core Materials reports that its BALTEK SB balsa core has been ABS-approved for more than 20 years.