17 March 2015
17 March 2015
Seeking to provide a solution with both performance and process efficiency disadvantages, Intertronics and manufacturers Polytec PT have introduced the PU 1000 formulation, an electrically conductive, polyurethane-based adhesive which could be considered as an interesting alternative to epoxy-based adhesives in various applications.
According to Intertronics, Polytec PU 1000 is an electrically conductive polyurethane which addresses applications in die attach, bonding of components in hybrid circuit applications and surface mount technology (SMT); areas where silver filled electrically conductive adhesives have been used for many decades. It says advantages include the simplicity of one-part application without mixing and an indefinite pot life with rapid cure at room temperature. For example10 minutes at 23°C compared to 15 minutes at 120°C for a typical two- part epoxy.
Intertronics explains that Polytec PU 1000 is a single-component, silver filled paste adhesive, which can be both stored and cured quickly at room temperature. It is described as flexible and elastic, which makes it ideal for bonding of flex-circuits, temperature-sensitive substrates or substrates with highly dissimilar coefficients of thermal expansion. It has found applications in smart cards and RFID circuitry, where cure can be effected in seconds. Intertronics claims that the adhesive can be dispensed automatically or applied manually and has rheological properties which are particularly suitable for the requirements of the jet type dispensers. It is suitable for electrically conductive bonding and coating applications on absorbing substrates like fabric, paper, leather, cork and non-absorbing substrates like glass, ceramics, PMMA, metals and most plastics.
Photo provided by Intertronics.