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Solvay's New Xydar LCP Resin Meets Demands of High-Speed Surface Mount Connectors

13 January 2015

Solvay Specialty Polymers has introduced Xydar MG-850 liquid crystal polymer (LCP), a new specially designed grade that meets the rigorous performance and processing demands of new high-speed USB 3.0 surface mount connectors.

This new material is designed to deliver the high flow, flatness, and dimensional stability required for new 12-gigabyte connectors that target applications in desktop and laptop computers, as well as tablets.

“The connector industry’s adoption of advanced fine-pitch technology* has placed even more exacting demands on materials,” said Glenn Cupta, Global Business Development Manager for electrical/electronics at Solvay. “Xydar MG-850 LCP offers manufacturers exceptional performance for these next-generation connectors, providing even tighter tolerances and lower warpage compared to our standard LCP material.”

According to Solvay, Xydar MG-850 LCP is a 50 percent glass/mineral reinforced polymer that fills thin walls over long flow lengths. The proprietary mineral and glass reinforcement package provides excellent warp resistance. It also exhibits a heat deflection temperature of 271°C (520°F) and infrared reflow capability up to 260°C (500°F). The material’s low moisture absorption facilitates improved IR reflow performance, according to Cupta.

Solvay says its new injection mouldable grade offers performance advantages over competitive low-warp LCPs, and doesn’t suffer from corrosion issues exhibited by other rival material technologies, such as halogen-free flame retardant polyphthalamide (PPA) resins. It explains that Xydar LCP is inherently flame retardant, transparent to microwave radiation and resistant to virtually all chemicals. The material has an UL 94 V0 flammability rating from Underwriters Laboratories of 0.2 mm without additives.

Available in black or natural colours, Xydar MG-850 LCP is sold globally to leading processors and connector manufacturers, with whom Solvay is working closely to help facilitate its application in next-generation USB 3.0 surface mount connectors for the personal computing market.






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