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AnalySwift Releases New Version of Micromechanics Program for Composites

13 March 2012

AnalySwift has released the newest version of the dramatically different general‐purpose micromechanics code, SwiftComp Micromechanics 3.0, also known as VAMUCH, which is designed to be a versatile micromechanics tool capable of saving users orders of magnitude in engineering time for heterogeneous structures and materials, particularly composites.

According to Dr. Wenbin Yu, CTO of AnalySwift “The unique technology underlying SwiftComp Micromechanics renders it the first truly general‐purpose micromechanics code, which can handle arbitrary microstructures and all the common physical properties. SwiftComp predicts the effective multiphysical properties within one analysis, as well as recovers detailed local fields.”

AnalySwift explain that primary among the new features are the program’s multiphysics capability. SwiftComp can be used to homogenise heterogeneous materials that have coupled or uncoupled responses to mechanical field, electric field, magnetic field, and thermal field. They say it not only predicts elastic, conductive, dielectric, magnetic, and diffusive properties of heterogeneous materials, but also coupled properties such as coefficients of thermal expansion, pyroelectric, pyromagnetic, piezoeletric, piezomagnetic, and/or electromagnetic properties, as well as the local fields corresponding to these multiphysical responses.

AnalySwift say this newest version can model Unit Cells (UCs) with curved edges or surfaces and also relax the restriction that the origin of the coordinate must be at the UC centre. They explain that it can also model temperature‐dependent materials with or without assuming small temperature variations.

Dr. Yu explains that “SwiftComp calculates effective properties and local fields directly with the same accuracy as the fluctuating functions. No post-processing calculations are needed for SwiftComp, which are indispensable for FEA‐based approaches but introduce more approximations, such as averaging stress or strain fields.” Dr. Yu continues, “An interface between SwiftComp and ANSYS is also available for taking advantage of the powerful preprocessing and postprocessing capability of ANSYS.” 

According to Allan Wood, President & CEO of AnalySwift, “Although SwiftComp Micromechanics is as versatile as a finite element analysis FEA‐based micromechanics approach, it is more efficient and convenient for the users. It can greatly increase the quality of products by achieving the best possible accuracy.”





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