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SP-High Modulus Exhibit at JEC Asia

26 June 2012

SP-High Modulus is exhibiting at JEC Asia 2012 this week at the Suntec International Convention and Exhibition Centre in Singapore.

According to SP, the exhibition is expected to bring global composite industry companies and representatives from the region together and is projected to attract over 7,000 visitors from 52 countries during the three day event.

SP will be located on booth number H10 and products to be exhibited include SP’s core range which includes Corecell, PVCell, G-PET and Balsaflex. Promoted alongside the core materials will be their range of adhesive and infusion products. Also highlighted will be their composite engineering experience.

Sean Jeffery, New Zealand and Southeast Asia Sales Manager commented “Having a booth at JEC Asia means that SP-High Modulus can showcase its advanced composite materials and engineering expertise to the important Asia market and we look forward to welcoming visitors to our booth to find out more about our products and services”.






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