NetComposites
Advanced Engineering 2019

Huntsman focuses on e-mobility at CWIEME

19 June 2012

 

At CWIEME 2012, Huntsman Advanced Materials will be showcasing its latest materials for encapsulation and insulation, demonstrating how its track record in innovation in the electronics market is helping to turn pioneering concepts for sustainable product systems into commercially viable propositions.

Huntsman explains that they offer a comprehensive range of organic protective solutions for electronic applications in the automotive sector.  They say that for more than 30 years, leading Tier suppliers as well as automotive OEMs have turned to the company for innovative solutions to build, structure and assemble printed circuit boards and to encapsulate, insulate and bond electrical and electronic components.

According to Huntsman, initiatives to reduce C02 emissions, rising fuel prices and the growing emphasis on e-mobility are all factors that have triggered the need to develop alternative forms of propulsion in the automotive market.  As a result, the electrification of powertrain systems is fast becoming a major focus for OEMs and suppliers.

Huntsman says they offer a wide range of encapsulating solutions which meet stringent requirements in terms of processability, thermal management, dielectric and mechanical properties.  Specifically designed to protect electronic components, these systems are suitable for plug-in-hybrids, semi-hybrids, full electric vehicles and can be found in electric motors (e-motors), inverters, converters and electronic control units (ECUs).

For e-motors, Aratherm XB 2731 is a good example of an advanced thermal conductive encapsulant offering outstanding heat conductivity (3 W/mK) and a glass transition temperature (Tg) of 160°C, according to Huntsman. Further to this they say Arathane CW 5620 / Arathane HY 5610 is an easy to process high-end polyurethane for ECUs which offers a low viscosity and high thermal conductivity.

Huntsman’s latest developments in the encapsulation and insulation of electronic components have been developed in response to market demands for advanced thermal management.  The company’s encapsulation, impregnation and insulation materials provide reliable technology for such thermal requirements with cold curing class F, low-temperature flexibility / low modulus and high service temperatures, offering safety and enhanced performance for low and high voltage applications.





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