01 June 2012
01 June 2012
Dow Automotive will take part in the Deutsche Kautschuk Tagung exhibition in Nürnberg, July 2ndto 5th, 2012 this year and will feature two new bonding agents.
According to Dow, MEGUM 5386 is a new two layer bonding agent (Cover II). MEGUM 5386 is characterised by high reactivity for reduced thickness of layers. Layer thickness can be cut back to 50%. With this new development Dow Automotive Systems reduces solvent-based emissions and mould fouling. On top, it provides for increased process stability. MEGUM 5386 is produced in Germany and available in September 2012. It is targeted for use in automotive NVH applications.
In addition to MEGUM 5386, Dow Automotive explains how they have continued development of their water-based bonding agents. New product MEGUM W1111 will support the complete elimination of solvent-based emissions.
Further, Dr. Philipp Zutavern, TS&D Manager, Dow Automotive, will present during the poster session on water-based rubber-to-substrate bonding agents. Dow can be found at DKT on stand 221 in Hall 12.
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