28 February 2012
28 February 2012
The Dow Chemical Company will be the corporate sponsor of the Technical Education Program and Technology Central at the NPE2012 international plastics exposition, taking place 1st – 5th April at the Orange County Convention Centre (OCCC) in Orlando, Florida.
According to Dow, they will be the exclusive corporate underwriter of the Society of Plastics Engineers (SPE) ANTEC 2012, which will be co-located with the NPE trade show. ANTEC will include more than 500 original peer-reviewed technical presentations.
In addition, Dow will sponsor what SPI has dubbed Technology Central in the North-South Hall of the OCCC. This will include SPI’s 2nd International Plastics Design Competition, four multi-exhibitor specialty pavilions, and a technology theater for presentations and demonstrations by exhibitors.
In addition to Dow’s underwriting commitment, Dow will directly participate in NPE2012 and the co-located ANTEC conference:
“Dow’s extensive involvement in the major NPE2012 programs is a way for us to support the industry and keep it strong, innovative, and growing,” said Mauro Gregorio, Commercial Vice President for Dow’s North America Performance Plastics. “We are particularly interested in the emphasis on innovation woven throughout many of the programs planned for NPE and we will make our contribution through presentations on a number of relevant topics.”
NPE is a triennial exposition founded and produced by SPI. “Dow’s extensive participation in NPE2012 reflects a strong involvement by resin manufacturers in general,” said Gene Sanders, SPI Executive Vice president of Trade Shows and Conferences. “Participation by these companies will be greater than it was at NPE2009 and include not just booths on the show floor but also customer hospitality centres nearby in the convention centre, conference presentations, and special-program displays.”
Thus far 1,830 companies have purchased 903,000sq.ft. (83,890sq.m) of exhibit space at NPE2012, and commitments by more companies can be expected between now and opening day, according to Gene Sanders, SPI’s Senior Vice President of Trade Shows and Conferences. SPI say the exhibit space total currently is one-fifth greater than the amount actually occupied at NPE2009. They explain that while visitor registrations will continue coming in over the coming weeks, registrations are ahead of the comparable NPE2009 and NPE2006 figures (those recorded the same number of weeks before the event) by 10% and 8%, respectively. Total registration for NPE2012 is expected to exceed 50,000—or 16% more than in 2009—and could approach 60,000, according to Sanders.
Airtech Advanced Materials Group is introducing three new high temperature vacuum bagging materials for thermoplastic moulding processes up to 427°C.