20 May 2011
20 May 2011
The organising committee for the SPE Automotive Composites Conference & Exhibition (SPE ACCE) will award two $2,000 USD scholarships for graduate-level research in polymer composites that has impact on ground transportation.
The scholarships are funded by proceeds from previous SPE ACCE conferences and donations made by the SPE Composites and Automotive Divisions. SPE has issued the application forms which are due on July 1, 2011 for the awards which will be announced in August 2011.
Winners will be selected from the pool of qualified applicants by SPE ACCE committee members and invited industry experts. Winning students will be required to report on the results of their findings during the twelfth-annual SPE ACCE, which takes place on the 11th to 13th September 2012. This is the fifth year conference organisers have offered these graduate-level scholarships to fund transportation composites research.
The 2010 SPE ACCE Scholarship Award winners were Benjamin Hangs, a doctoral candidate at the Fraunhofer Institute of Chemical Technology who will present his work on Integration of Features into Parts made from Thermoplastic Unidirectional Tape-Overview & Case Study at this year's conference; and Francesco Deleo, a doctoral student in at the University of Washington, the results of whose project will be presented this September on Crashworthiness Energy Absorption of Carbon Fibre Composites: Experiment & Simulation.
The first scholarships were given in 2007 in honour of journalist and composites-industry insider, Steve Loud who passed away in 2006. The recipients were Roston Elwell from Texas A&M University for research on the Use of Active-Core Composite Sandwich Panels for Improved Automotive Safety; and Alejandro Londono-Hurtado from University of Wisconsin-Madison, whose work involved Simulation and Numerical Modelling of Fibre Orientation and Density Distribution During Moulding of Fibre-Reinforced Automotive Parts.
Held annually in suburban Detroit, the SPE ACCE typically draws 400+ speakers, exhibitors, sponsors, and attendees from 14 countries.
The Scholarship Application form is available for download using the SPE ACCE link below.
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