12 May 2011
12 May 2011
Dr Barry Davidson, a professor in the Department of Mechanical and Aerospace Engineering at Syracuse University, has received the Wayne W. Stinchcomb Memorial Award from ASTM International Committee D30 on Composite Materials for Contributions to Composite Materials Standards.
The Stinchcomb Award is presented every two years to an individual who has made outstanding contributions in research, engineering, or teaching the technology of composite materials and who has provided outstanding service to Committee D30 or any other technical organization with emphasis on the study and advancement of composites. Davidson has been a member of ASTM International and Committee D30 since 1993.
Davidson's research focuses on the design, analysis and testing of composite materials, with emphasis in delamination growth in advanced polymeric composites. His research work has been supported by NASA, the Federal Aviation Administration, the Office of Naval Research, the Empire State Development Corporation, the AT&T Foundation, the National Science Foundation, U.S. Army Intelligence Center, the National Institutes of Health, United Technologies Corporation and the Jet Propulsion Laboratory.
Solvay has signed a ten-year agreement for the supply of composites and adhesives to be used across Bell's military and commercial rotorcraft programmes, including the Bell 429, 407, 505, 525, V-22, and UH-1.
SGL Carbon and Fraunhofer IGCV have officially opened the Fibre Placement Centre (FPC) at SGL's site in Meitingen, Germany. Compositence, BA Composites and the Chair for Carbon Composites at the Technical University of Munich have also joined the alliance, and Coriolis Group and Cevotec are planning to come on board as partners.
With the aim developing a broader platform for additive manufacturing (AM) technologies, the University of Exeter, UK, and Victrex, have formed a strategic partnership to introduce next-generation polyaryletherketone (PAEK) polymers and composites while improving the performance of the underlying AM processes.