13 December 2011
13 December 2011
EADS Innovation Works and DolphiTech have signed an agreement for the development of a new non-destructive testing (NDT) system based on an innovative ultrasonic camera component for composite inspections.
DolphiTech say that the new tool can be used for all types of NDT applications for composite materials, is simple, easy to operate, and more favourably priced than existing NDT camera systems. A prototype will be available by the end of 2012.
“The new system will speed up NDT procedures in manufacturing and maintenance and will help the users to save time and money,” said Martin Bach, NDT specialist at EADS Innovation Works.
“The adaptation of our novel ultrasound technology for impact assessment by EADS Innovation Works and the EADS Divisions will open a very attractive global market for our technology,” said DolphiTech’s managing director Terje Melandso. “After many years of Research and Development supported by Innovation Norway we have patented the world’s first ultrasonic 2D barcode reader. The cooperation and marketing opportunities within EADS, its suppliers and customers will be very valuable for DolphiTech when we launch the technology on the aerospace market.”
Solvay has signed a ten-year agreement for the supply of composites and adhesives to be used across Bell's military and commercial rotorcraft programmes, including the Bell 429, 407, 505, 525, V-22, and UH-1.
SGL Carbon and Fraunhofer IGCV have officially opened the Fibre Placement Centre (FPC) at SGL's site in Meitingen, Germany. Compositence, BA Composites and the Chair for Carbon Composites at the Technical University of Munich have also joined the alliance, and Coriolis Group and Cevotec are planning to come on board as partners.
With the aim developing a broader platform for additive manufacturing (AM) technologies, the University of Exeter, UK, and Victrex, have formed a strategic partnership to introduce next-generation polyaryletherketone (PAEK) polymers and composites while improving the performance of the underlying AM processes.