31 May 2010
31 May 2010
SAMPE 2010 ended with a ceremonious awards luncheon, closing out the conference that was in Seattle for the first time.
The event attracted 70 new exhibiting companies, with 300 total exhibiting companies, over 350 technical presentations and eight tutorials being presented. A total of 5,031 attendees participated with the conference and exhibition.
""M&P companies recognize that SAMPE is the premiere forum for advanced materials and processes. It’s vital for companies that wish to grow and succeed to have a presence here,"" noted SAMPE President Steve Rodgers, Director of R&D with ITT Integrated Structures, Salt Lake City, Utah. ""SAMPE 2010 offered an experience to advanced M&P professionals and companies that can’t be found anywhere else. Only SAMPE can deliver this experience.""
There was heavy foot traffic every day in the exhibit hall, which pleased exhibitors and attendees alike. This year, back by popular demand was the presentation stage, where exhibitors demonstrated products and answered questions.
“Throughout the week we received enthusiastic feedback from all types of attendees,” SAMPE Executive Vice President Allan Crasto, Associate Director at the University of Dayton Research Institute, Dayton, Ohio said. “Many people were overwhelmed by the success of this event and are already making plans to attend next year in Long Beach.”
On Monday, May 17, SAMPE inducted six new SAMPE Fellows into the SAMPE Fellow Program. Gail L. Hahn, The Boeing Company; Jose M. Kenny, Ph.D., University of Perugia, Department of Civil and Environmental Engineering; Vsevolod G. Lutsau, Ph.D. (Posthumous), IMASH, Mechanical Engineering Research Center, Moscow, Russia; Yasushi Miyano, Ph.D., Kanazawa Institute of Technology, Materials System Research Laboratory; Stephen W. Tsai, Ph.D., Stanford University, Department of Aeronautics and Astronautics; and Douglas D. Ward, GE Aviation were recognized for their leadership, creativity and vision in the field of material and process engineering.
The conference officially kicked off Tuesday with a keynote presentation presented by Professor Morinobu Endo from Shinshu University, Japan on “High-Performance Carbon Nanotube-Incorporated Polymeric Nanocomposites”.
Wednesday's keynote presenter Frank Doerner, Vice President – Materials, Processes & Structures Technologies from Boeing Research & Technology gave a talk on ""New Materials and Processes Driving Boeing’s Products Forward.""
In addition to keynote presentations, conference attendees had their pick of distinguished lectures, panels and sessions to attend. Topics included natural materials, out-of-autoclave technology, design and analysis, tooling, repair, and nondestructive evaluation to name a few.
""This year’s conference program offerings were especially diverse,"" said SAMPE 2010 General Co-Chair Ali Yousefpour, National Research Council, Canada. ""We added 100 presentations to the typical program. Authors presented work on new research, developments, and applications. The work of these engineers will shape the future of our industry. Thus, we value the contributions made by all of our conference volunteers. Without their efforts, a program of this magnitude would not have been possible.""
SAMPE 2011 will be sponsored by SAMPE’s Orange County Chapter. The conference dates are May 23-26, 2011 and the exhibition dates are May 24-26, 2011. The program will be held at the Long Beach Convention Center in Long Beach, California. The event will be co-located with Aeromat 2011.
TRB Lightweight Structures has recently gained the highest DIN 6701 (Parts 1-4) A1 type certification.
Angel Trains, one of Britain’s leading train leasing companies, has collaborated with engineering consultancy ESG Rail, and 3D printing technology provider Stratasys, to produce four fully approved interior components using 3D printing, also known as Additive Manufacturing.
Composite products, based on polyurethane technologies from global chemical company Huntsman, are taking centre stage at a design exhibition at the Design Museum Gent, Belgium.