NetComposites
Thermwood

Evonik’s New Single-Component Resin System

25 September 2009

This year’s SAMPE will give Evonik Industries the opportunity to showcase its newly developed polyaryl ether amide resin system, Calidur.

According to manufacturers, the product has enhanced fibre adhesion, which allows it to improve the mechanical properties of bonded fibre materials to create components with both high compressive strength and shear strength.

Because of these improvements, Calidur should be suitable for use in structural components; the material boasts high temperature resistance, low moisture absorption, and good resistance to chemicals, as well as low exotherm and minimal shrinkage in the curing process.

In addition to this, Evonik say that fabrics treated with Calidur also are significantly more flame retardant than those treated with conventional epoxy resins. As a result, the product is suitable for interior aircraft applications in the aerospace industry, especially since the system is formaldehyde free.






Related / You might like...

Solvay and Bell Sign Rotorcraft Supply Agreement

Solvay has signed a ten-year agreement for the supply of composites and adhesives to be used across Bell's military and commercial rotorcraft programmes, including the Bell 429, 407, 505, 525, V-22, and UH-1.

SGL Carbon Celebrates Opening of Fibre Placement Centre

SGL Carbon and Fraunhofer IGCV have officially opened the Fibre Placement Centre (FPC) at SGL's site in Meitingen, Germany. Compositence, BA Composites and the Chair for Carbon Composites at the Technical University of Munich have also joined the alliance, and Coriolis Group and Cevotec are planning to come on board as partners.

Victrex and Exeter University Partner on PAEK Additive Manufacturing

With the aim developing a broader platform for additive manufacturing (AM) technologies, the University of Exeter, UK, and Victrex, have formed a strategic partnership to introduce next-generation polyaryletherketone (PAEK) polymers and composites while improving the performance of the underlying AM processes.