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Thermwood

Family of 3D Woven Pi Cross-Sectional Profiles Developed

31 March 2008

Biteam has developed the first ever fully 3D woven family of Pi (ð) cross-sectional profiles, with 6 different sections displayed at JEC.

The availability of different cross-sectional shapes of 3D woven Pi profiles offers the structural engineers and designers a unique flexibility in designing a construction using profiled beams made of composite materials. Also, it opens up the opportunity to mix and match different 3D woven profiles besides enabling relatively economical and quicker modular construction.

A variety of fully 3D woven Pi and other cross-sectional profiles can be produced in solid, shell, tubular and combination types to meet different application demands. Such 3D woven cross-sectional profiled materials are directly produced with unique performance and functional features.





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