27 November 2007
27 November 2007
Diab has added a new fully recyclable, thermoplastic core material to its extensive range that is designed to offer excellent FST (fire, smoke and toxicity) performance coupled with good mechanical properties and a wide processing envelope.
Designated Divinycell P, the new material is also said to offer good acoustic/thermal insulation properties, low water absorption, good chemical resistance and can be readily thermoformed. It is currently available in three densities - 60, 100 and 150 kg/m3.
Although suitable for a wide range of uses, DIiab says that Divinycell P is a particularly cost effective solution for sandwich composite applications in the public transportation, wind energy and industrial/construction markets. With its M1/F1 rating according to the NF F 16-101 standard and compliance with DIN 5510 S4 ST2 SR2, the new core material is suitable for applications where FST properties are required.
For transportation applications Divinycell P can be used for interior panelling, floors and exterior panels for trains, trams, buses and coaches. In the wind energy market it is intended for use in nacelles and spinners. Industrial applications for Divinycell P are likely to include domes, architectural claddings, industrial housings, portable buildings and heating and ventilation insulation.
Divinycell P is available in a range of finishes to facilitate installation, enhance component quality and to meet specific processing requirements. These include grid-scored, double cut and 'infusion' grooved/perforated forms. It can also be supplied as ‘ready to use’ core kits.
NTPT is collaborating with the Ecole polytechnique fédérale de Lausanne - Swiss Centre of Technology (EPFL) and other partners to research discontinuous fibre composite tubes for high performance applications.
The £50 million McLaren Composites Technology Centre (MCTC) nearing completion near Sheffield, UK, was inaugurated on 16 January.
Scott Bader is exhibiting its Crestabond structural adhesives at the Automotive Lightweight Technologies Expo in Tokyo, Japan, on 17-19 January 2018.