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Henkel Develops Durable New Nacelle Film Adhesive

19 November 2007

A state-of-the-art, high temperature and durability, epoxy-based film adhesive, Hysol EA 9658, has been developed by the aerospace group of Henkel Corporation.

Designed for composite or metal bonding, Hysol EA 9658 reticulates for optimum acoustic efficiency. Hysol EA 9258.1 is a new companion water-based chromated primer.

Hysol® EA 9658 is a 177°C (350°F) cure system targeted for the highly demanding aerospace nacelle bonding applications. According to Henkel, this next generation nacelle film adhesive, as compared to the industry standard, possesses unusually high toughness and peel strength while maintaining superior high temperature properties. They say that a unique advantage of this new technology is the controlled flow, which enables it to perform well in reticulated sound suppression nacelle structures.





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