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Bond Behaviour of FRP in Structures

04 February 2007

A special issue of the international journal Advances in Structural Engineering on Bond Behaviour of FRP in Structures has recently been published and is freely available.

This special issue contains extended and revised versions of 8 papers selected from those presented at the International Symposium on Bond Behaviour of FRP in Structures (BBFS 2005), which was held on 7–9 December 2005 in Hong Kong, China. The Symposium was organised by the Working Group on Bond between FRP and Concrete (the Bond WG) of the International Institute for FRP in Construction (IIFC), in conjunction with the Department of Civil and Structural Engineering, The Hong Kong Polytechnic University.

The papers cover a wide range of bond behaviour issues including fundamental bond mechanisms, debonding failures, dynamic and cyclic loadings, fatigue, durability, and the effects of elevated temperature and fire. They report the current state-of-the-art and point to future directions of research in this exciting area.

  • The Importance of Bonding-a Historic Overview and Future Possibilities
  • FRP Plates Adhesively Bonded to Reinforced Concrete Beams: Generic Debonding Mechanisms
  • Analysis of the Load-Deformation Behaviour and Debonding for FRP Strengthened Concrete Structures
  • Fracture Mechanics Approach to Geometrically Nonlinear Debonding
  • Problems in RC Beams Strengthened with Composite Materials
  • Deterioration of FRP-to-Concrete Bond under Failure Loading
  • Advances in Adhesive Joining of Carbon Fibre/Polymer Composites to
  • Steel Members for Repair and Rehabilitation of Bridge Structures
  • Bond Behavior of CFRP Strengthened Steel Structures
  • Experimental and Numerical Investigation of the Behaviour and Strength of Composite Steel-CFRP
  • Members

The entire issue has been made freely available to researchers worldwide via the IIFC web site (first link below – 8mB file). Other papers from the symposium can also be found on the IIFC web site at the second link below.






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