26 November 2006
26 November 2006
YLA’s newest resin family, Xponent, has enabled down hole instrument manufacturers to design and fabricate a variety of instrument housings, packers, diverters and other high value components that meet the tough environmental conditions.
YLA offers Xponent BMI (bismaleimide) in various composite forms such as prepreg, towpreg and custom compression moulded components and moulding compound.
"Our motivation is to leverage our successful aerospace research for the benefit of the oil and gas industry, where extremely high performance is needed for M/LWD," said Samuel Sher, YLA’s Director of Marketing and Business Development. "As our products prove daily in the most demanding aerospace and extraterrestrial applications, chemically-engineered high temperature thermoset resins like the new Xponent family are rapidly replacing metals." Sher predicts that composite materials like the Xponent family will supplant metals as a problem-solving solution in petrochemical exploration and production, mirroring current trends in aerospace.
Survival of down hole instrumentation is an engineering challenge due to extreme pressure, heat and vibration.
"Bismaleimide or BMI resins and carbon fiber composites like the Xponent family are rapidly evolving, superceding some of the highest performance metals," said Tom Jonas, YLA’s Manager of Research and Development. "When used for down hole M/LWD in packers and telemetry housings, Xponent-based components gain qualities difficult to achieve with metals, including RF and magnetic field transparency and rapid drill-through. Typical uses for the housings include real time formation pressure, temperature, density, neutron porosity and magnetic measurements and geologic (seismic) data acquisition. From a life cycle standpoint, YLA’s technology yields components that do much more at lower overall cost." "Production volumes of key composite components will soon be available to the petrochemical market, from our customer-partners," said Sher. "YLA is seeking new active partnerships with M/LWD developers to advance the use of these and other composites in their line cards."