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Laird Introduces Thermally Conductive Prepreg

04 June 2006

Laird Technologies has introduced its T-preg HTD, a thermally conductive, electrically insulating pre-preg with high temperature and voltage properties for use in printed circuit boards (PCBs) for automotive and motor control applications.

Part of the Laird Technologies' T-lam(TM) line of products, the T-preg HTD is used to isolate copper circuit layers from an aluminum or copper base plate when making a metal-based PCB. It has a UL relative temperature index (RTI) rating of 150 C, claimed to be the highest operating temperature rating available for a thermally conductive pre-preg substrate.

""The high operating temperature of the HTD extends Laird Technologies' position as aAdvertisement market leader in the thermally conductive pre-preg segment,"" said Michael Dreyer, vice president and general manager, Laird Technologies' Thermal Products Division. ""Our customers have consistently asked us to supply a pre-preg with a higher operating temperature rating for the marketplace, and we have responded with the T-preg HTD product.""

The T-preg HTD's pre-preg format allows the designer to improve the thermal performance of standard printed circuit boards or to create power substrates on metal base plates.

""The high-temperature operation is particularly important to applications under the hood of an automobile, especially when attached to the engine,"" said Bob Kranz, product manager, Laird Technologies' Thermal Products Division. ""The combination of high-temperature operation and high-voltage isolation delivers the performance required for the 240 and 480 volt commercial and industrial applications, like motor control and ballast lighting.”






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