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New Low-Profile Additives Introduced for Pultrusion & Compression Moulding

11 December 2006

Reichhold has introduced two new low-profile additives (LPAs) for pultrusion and compression moulding applications: Polylite 31702-40, PVAC low-profile additive for pultrusion and Polylite 31701-35, low-profile additive for SMC/BMC applications.

Polylite 31702-40 is a 40% solids PVAC low-profile additive, developed to allow pultruders to fabricate glossy and smooth profiles for applications which demand improved cosmetic and aesthetic properties.

Polylite 31701-35 is a 35% solids polystyrene, low-profile additive, developed to provide SMC/BMC compounders with the ability to develop low-shrink formulations for compression moulding applications.