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Thermwood

Seminar on Fundamentals of Composite Technologies

16 September 2005

A seminar running concurrently with the Composites 2005 conference aims to provide an overview of how composite technologies are used for manufacturing different products.

With the registration date fast approaching and with space limited, the conference organisers request would-be delegates to register their interest as soon as possible.

Composites manufacturing technologies operate in a $42 billion composites market and are used to make parts for automotive, aerospace, construction, sporting goods, electrical, industrial, energy and other industries. Each industry’s requirements are different and thus a suitable process is selected based on application requirements.

This seminar entitled, “Composites Technology: Fundamentals, Applications and Trends” will help attendees understand where a particular technology fits within the overall fabrication scheme and what processes might be suitable for the manufacture of a particular component. The following key topics will be discussed:

Fundamentals of composites technologies
Market size estimates for various composites technologies
Assessment of composites technologies
Commonly used composites technologies in major market segments such as automotive, marine, aerospace, sporting goods, construction, and several others
Competing technologies and materials in various applications
Trends in composites technologies.

This half day seminar (8:15 am 12:00 noon) will be held at Hyatt Regency, 350 North High Street, Columbus, Ohio on September 28, 2005. It conveniently coincides with the Composites 2005 conference which will take place in Columbus, Ohio September 28-30.

This seminar is designed for technology managers, market developers, project managers, sales managers, market and business development managers, analysts and executives.

To learn more about this seminar (pricing and other detail) or to register your interest, please contact Troy Abernathy at +1 616 243-4444 or by the email/web address below:





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